Matica DIK 10044 Cleaning Kit for XID Retransfer Card Printers

EDIsecure DIK10044 Complete Cleaning Kit

Item model number: DIK 10044

The product includes 10 cleaning wipes, 10 large sticky dust cards, and 10 soaking swabs.

The EDI Retransfer Printer Cleaning Kit is suitable for the following EDI Secure printer series:

EDI Secure XID & IDX Series, IDX3xx, DIS XID 430/440/450, XID 560/570/580/590ie, XID 8300, XID 9300/9330.

Description

Matica XID EDI retransfers printer cleaning kit cleaning wipes industrial alcohol swab.

EDI Secure DIK 10044 Retransfer Printer Cleaning Kit for EDI Secure XID and Secure IDX series, IDX3xx, DIS XID 430/440/450, XID 560/570/580/590ie, XID 8300, XID 9300/9330.

The EDI Secure DIK 10044 Cleaning Kit provides comprehensive cleaning and maintenance for your retransfer printer. The large sticky dust card is designed to remove dust, while the soaked swab is used to clean the print head.

The cleaning wipes can be used to clean the parts, casing and interior of the printer. shell.

EDI Secure Cleaning Wipes Specifications:

Fabric Material: 100% Polyester Spunlace

Dimensions: 5” x 6” (inches) Thickness tolerance +/- 0.1”

127 x 152 (mm) thickness tolerance +/- 2.54 mm

Bag size (mm): 63 x 88

Solution content : 99.9% IPA

IPA volume : 1.0 +/- 0.5 ml

 

EDI Secure Large Sticky Dust Card Specifications:

Card material: PVC plastic core

Double-sided tape: 50μm

Release paper thickness: 100μm

High Adhesion : 5.5N/10mm

Operating temperature range : -30°to 204°C

Corner radius : 4 sides

 

EDI Secure Soaked Swab Specifications:

Swab tip: 100ppi, closed cell, polyester polyurethane composite sponge

Handle Material: Polypropylene

Handle Size (Length x Diameter) : Approx. 5.0” x 0.200” or 114 X 5.2 (mm)

Swab Tip Dimensions (L x W) : 0.984” x 0.591” or 25 x 15 (mm)

Filling solution : 99.9% IPA solution

Solution content : 2.0 ml

Reviews

There are no reviews yet.

Be the first to review “Matica DIK 10044 Cleaning Kit for XID Retransfer Card Printers”

Your email address will not be published. Required fields are marked *